Large Area Electronic Skin

Technological advances have enabled various approaches for developing artificial organs such as bionic eyes, artificial ears, and lungs etc. Recently electronics (e-skin) or tactile skin has attracted increasing attention for its potential to detect subtle pressure changes, which may open up applications including real-time health monitoring, minimally invasive surgery, and prosthetics. The development of e-skin is challenging as, unlike other artificial organs, tactile skin has large number of different types of sensors, which are distributed over large areas and generate large amount of data. On top of this, the attributes such as softness, stretchability, and bendability etc., are difficult to be achieved as today's electronics technology is meant for electronics on planar and stiff substrates such as silicon wafers. This said, many advances, pursued through “More than Moore” technology, have recently raised hope as some of these relate to flexible electronics and have been targeted towards developing e-skin. Depending on the technology and application, the scale of e-skin could vary from small patch (e.g. for health monitoring) to large area skin (e.g. for robotics). This invited paper presents some of the advances in large area e-skin and flexible electronics, particularly related to robotics

Multiple facets of tightly coupled transducer-transistor structures

The ever increasing demand for data processing requires different paradigms for electronics. Excellent performance capabilities such as low power and high speed in electronics can be attained through several factors including using functional materials, which sometimes acquire superior electronic properties. The transduction-based transistor switching mechanism is one such possibility, which exploits the change in electrical properties of the transducer as a function of a mechanically induced deformation. Originally developed for deformation sensors, the technique is now moving to the centre stage of the electronic industry as the basis for new transistor concepts to circumvent the gate voltage bottleneck in transistor miniaturization. In issue 37 of Nanotechnology, Chang et al show the piezoelectronic transistor (PET), which uses a fast, low-power mechanical transduction mechanism to propagate an input gate voltage signal into an output resistance modulation. The findings by Chang et al will spur further research into piezoelectric scaling, and the PET fabrication techniques needed to advance this type of device in the future

Printable Electrodes for Flexible Supercapacitors

No abstract available

E-skin: from humanoids to humans

With robots starting to enter our lives in a number of ways (e.g., social, assistive, and surgery), the electronic skin (e-skin) is becoming increasingly important. The capability of detecting subtle pressure or temperature changes makes the e-skin an essential component of a robot's body or an artificial limb [1], [2]. This is because the tactile feedback enabled by e-skin plays a fundamental role in providing action-related information such as slip during manipulation/control tasks such as grasping, and estimation of contact parameters (e.g., force, soft contact, hardness, texture, and temperature during exploration [3]). It is critical for the safe robotic interaction - albeit as a coworker in the futuristic industry 4.0 setting or to assist the elderly at home

Multifunctional Flexible PVDF-TrFE/BaTiO3 Based Tactile Sensor for Touch and Temperature Monitoring

This paper presents an enhanced piezoelectricity based sensor for touch and temperature sensing. The sensor is realized over flexible polyimide film, making it suitable for application like e-skin. The sensing material is composed of Polyvinylidene Fluoride-Trifluoroethylene (PVDF-TrFE) and Barium Titanate (BaTiO3) nanoparticles. While, the piezoelectric polymer PVDF-TrFE ensures the flexibility of sensor, BaTiO3 imparts high sensitivity to touch and temperature. The sensor is tested over temperature range which is common in daily life and the sensitivity to touch is characterized by tapping mode using fixed load. The results confirms the advantage of using poly-ceramic composite over piezoelectric polymer

Wearable Capacitive-based Wrist-worn Gesture Sensing System

Gesture control plays an increasingly significant role in modern human-machine interactions. This paper presents an innovative method of gesture recognition using flexible capacitive pressure sensor attached on user’s wrist towards computer vision and connecting senses on fingers. The method is based on the pressure variations around the wrist when the gesture changes. Flexible and ultrathin capacitive pressure sensors are deployed to capture the pressure variations. The embedding of sensors on a flexible substrate and obtain the relevant capacitance require a reliable approach based on a microcontroller to measure a small change of capacitive sensor. This paper is addressing these challenges, collect and process the measured capacitance values through a developed programming on LabVIEW to reconstruct the gesture on computer. Compared to the conventional approaches, the wrist-worn sensing method offerings a low-cost, lightweight and wearable prototype on the user’s body. The experimental result shows that the potentiality and benefits of this approach and confirms that accuracy and number of recognizable gestures can be improved by increasing number of sensor

PDMS residues-free micro/macrostructures on flexible substrates

Transfer printing has been reported recently as a viable route for electronics on flexible substrates. The method involves transferring micro-/macrostructures such as wires or ultra-thin chips from Si (silicon) wafers to the flexible substrates by using elastomeric transfer substrates such as poly(dimethylsiloxane) (PDMS). A major challenge in this process is posed by the residues of PDMS, which are left over on Si surface after the nanostructures have been transferred. As insulator, PDMS residues make it difficult to realize metal connections and hence pose challenge in the way of using nanostructures as the building blocks for active electronics. This paper presents a method for PDMS residues-free transfer of Si micro-/macrostructures to flexible substrates such as polyimide (PI). The PDMS residues are removed from Si surface by immersing the transferred structures in a solution of quaternary ammonium fluoride such as TBAF (Tetrabutylammonium Fluoride) and non-hydroxylic aprotic solvent such as PMA (propylene glycol methyl ether acetate). The residues are removed at a rate (∼1.5 μm/min) which is about five times faster than the traditional dry etch methods. Unlike traditional alternatives, the presented method removes PDMS without attacking the flexible PI substrates

Electrochemical Sensors with Screen Printed Ag|AgCl|KCl Reference Electrodes

This paper presents the printed thick film Ag|AgCl|KCl reference electrodes for electrochemical or biosensors application and their electrochemical and analytical performance. The reference electrode exhibits a stable potential against standard glass reference electrode with a potential difference of 5 mV in the deionized water. The anodic and cathodic peak current of the electrode increase with the increase in scan rate in the range of 25-150 mVs-1. The open circuit potential response of thick film reference electrode in the NaCl concentrations range (30-100 mM) was measured and it shows a stable potential in each test solution. The fabricated reference electrode shows an excellent application for an electrochemical pH sensor

Paper Based Pressure Sensor for Green Electronics

This work reports a resistive paper-based disposable pressure sensor based on porous 3D conductive cellulose micro-fiber network. The conductivity in microfibers was achieved by subjecting the network to graphene oxide (GO) - poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT: PSS) solution. The modified cellulose matrix is sandwiched between graphite paper electrodes so that overall structure is flexible. The device tested in 32-386 Pa range detected a minimum of 34 Pa and exhibited fast dynamic response (in tenths of seconds) with excellent repeatability. The proposed approach for disposable sensors is a step towards green electronics and holds promise for wide range of wearable applications

Modeling of CMOS devices and circuits on flexible ultrathin chips

The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)